Phenolic Foam Insulation — Thin Build-Up, Low Lambda

By Dhruv Agarwal · · 1 min read

What it is

A rigid closed-cell phenolic resin foam, usually faced with aluminium foil or a glass tissue. It has the lowest thermal conductivity of the common rigid insulation boards.

Specification at a glance

PropertyTypical specification
StandardEN 13166
Thermal conductivityApproximately 0.018 — 0.021 W/mK
Thickness20mm — 100mm
FacingAluminium foil, or glass tissue
Fire classNamed EN 13501-1 class; chars rather than melts
FriabilityHigher than PIR; handle with care

Thickness for a U-value, compared

Indicative, before thermal bridging, for approximately 0.25 W/m²K:

MaterialApproximate thickness
Phenolic~80mm
PIR~90mm
EPS~150mm
Rock wool~150mm

That difference is the entire argument for phenolic. Where it does not matter, it usually is not worth the premium.

Where it belongs

Refurbishments with fixed floor-to-ceiling heights · duct insulation in congested ceiling voids · roof build-ups where upstand heights are already set by existing thresholds · any envelope where the U-value target cannot be met in the available depth with a cheaper board.

Where projects go wrong

  • Used where depth is not constrained, paying a premium for nothing.
  • Handled roughly. Crumbled edges leave gaps in the insulation line.
  • Assumed non-combustible. It is not.
  • Facing damaged and not repaired, losing the vapour control function.
  • Cut undersize, leaving gaps that undo the thermal advantage the material was chosen for.

Standards referenced

Phenolic foam products under EN 13166. Reaction-to-fire classification to EN 13501-1. Opaque assembly U-value targets under ECBC 2017.

Standards referenced

  • EN 13166Thermal insulation products — factory made phenolic foam
  • EN 13501-1Reaction to fire classification
  • ECBC 2017Building envelope — opaque assembly U-value

Frequently asked

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